Product Code: Breadboard 840 Tie Points High Quality
Availability: In Stock


Solderless Breadboard withh 400 tie point. It has 2 power buses, 10 columns, and 30 rows. All pins are spaced by a standard 0.1". The two sets of five columns are separated by about 0.3", perfect for straddling a DIP package over. The board accepts wire sizes in the range of 29-20AWG.


  • Quick circuit testing and mock-up
  • 840 Contact Points
  • Suitable for most IC's, Standard 0.1' Spacing
  • Positive and Negative Power Rails on Top and Bottom

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